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A versatile dry etching device boasting hundreds of successful installations.
● High selection ratio and high-precision etching are possible. ● Automatic operation and process parameter storage are possible with PLC control. ● Samples up to φ8 inches can be accommodated. ● High-speed exhaust etching is possible. ● Compact design.
We have a track record of devices such as "XeF2 etching equipment" and "batch-type ashing equipment."
We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "Dry Etching Equipment." We have a track record of "ICP Etching Equipment for Research and Development," "ICP Plasma Etching Equipment," "XeF2 Etching Equipment," and "Batch-type Ashing Equipment." Sample processing is being conducted using demo units. Please feel free to contact us when needed. 【Manufacturing Achievements】 ■ ICP Etching Equipment for Research and Development ■ ICP Plasma Etching Equipment ■ XeF2 Etching Equipment ■ Batch-type Ashing Equipment *For more details, please refer to the PDF materials or feel free to contact us.
Switching between RIE mode and DP mode is possible! Reduction of metal contamination through special surface treatment.
The "Dry Etching Equipment" is a mass production device capable of fully automatic continuous processing of substrates up to φ12 inches. It features a dual-frequency independent application method that reduces metal contamination through special surface treatment. We also offer multi-chamber specifications and various custom-made options. This versatile device enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduction of metal contamination through special surface treatment ■ Compact footprint ■ Dual-frequency independent application method ■ Ultra-low temperature cooling stage *For more details, please refer to the PDF materials or feel free to contact us.
